CWI represents companies with leading three-dimensional integrated circuit (3D IC) solutions for Univerisities, R&D, and small to large companies.
Using deep through-silicon vias (TSVs) to electrically connect a stack of chips, 3D interconnect technology bonds semiconductor wafers and die to
produce multilevel chips with an optimum combination of cost, functionality, performance and power consumption.By combining the performance and
power of system-on-chip (SOC) with the functionality and time-to-market advantages of system-in-package (SiP), TSV offers the best of both for
achieving very high densities for memory and logic. Whether you are searching for a manual, semi-automated, or fully-automated systems the
leading companies we represent have the solutions.