3D Integration
CWI represents companies with leading three-dimensional integrated circuit (3D IC) solutions for Univerisities, R&D, and small to large companies.
Using deep through-silicon vias (TSVs) to electrically connect a stack of chips, 3D interconnect technology bonds semiconductor wafers and die to
produce multilevel chips with an optimum combination of cost, functionality, performance and power consumption.By combining the performance and
power of system-on-chip (SOC) with the functionality and time-to-market advantages of system-in-package (SiP), TSV offers the best of both for
achieving very high densities for memory and logic. Whether you are searching for a manual, semi-automated, or fully-automated systems the
leading companies we represent have the solutions.
Die to Wafer Bonding:
Manual, Semi-Automated and
Fully-Automated Systems
Up to 12 inch Wafers
Die Bonding and Flip Chip Bonding:
Manual, Semi-Automated and
Fully-Automated Systems
Down to 0.5µm Alignment Accuracy
Defect, Bump, Probe Mark & TSV Inspection:
Inspection of Diced Wafers, 2D and 3D Inspection and Measurement of Bumps/Pillars, and other backend applications
Wafer to Wafer Bonder:
In-situ up to 1.0µm Alignment  Accuracy Bonding System of Wafer sizes from 2 - 12 inchs
Wire Bonding:
Manual, Semi-Automated and
Fully-Automated Systems
Wedge and Ball Bonding
Wafer to Wafer.
Die to Wafer.
Inspect.
Analyze.
Automated Optical Inspection System:
Redefining Inspection - Submicron Detection at 100% Inspection and Review
Acoustic Microscopy System: C-Mode Scanning Acoustic Microscope (C-SAMŽ) - Nondestructive Failure Analysis
Die Bonding System:
Fully-Automated Die Bonder
Between 7 to 10 µm Alignment Accuracy
Die Bonding System:
Manual High Accuracy Die Bonder
Z-Drive with Bonding Force Control
10µm Alignment Accuracy
Defect, Bump, & TSV Inspection:
Inspection of Diced Wafers, 3D-IC Market Inspection and Measurement System
       
CWI Technical Sales  ˇ  Phone: 732-536-3964  ˇ  Fax: 732-536-0495  ˇ