Acoustic Microscopy
Since its inception, Sonoscan has remained the most trusted authority on the application of Acoustic Microscopy, also known as Acoustic Micro Imaging (AMI) technology for nondestructive internal inspection and analysis. Sonoscan acoustic microscopes are recognized as the benchmark for accuracy, and through our SonoLab® division, you'll benefit from the unmatched expertise of our dedicated acoustic applications engineers.
Benefits of AMI (Acoustic Micro Imaging)
Locates hidden flaws before they lead to failures
Detects delamination as thin as 200 Angstroms
Isolates material property variations
Measures material density, porosity, inclusions, cracks and voids
Assesses thermal, impact and fatigue damage
Nondestructive
FastLineTM P300TM C-SAM®:
Maximum Throughput, Minimal Footprint for the Factory Floor
The FastLineTM P300TM Acoustic Microscope is specifically designed for accelerated
inspection throughput in manual screening of microelectronic devices on the manufacturing
floor. With an integrated design to minimize footprint, the FastLine is the new platform for
Acoustic Microscopes.

FastLineTM P300TM features a new electronics platform to meet current and next generation
applications. New Movement MapTM technology delivers precise transducer positioning, while
the Visual Poly-GateTM mode allows for simple and instant multiple depth imaging. These
innovative features along with the higher speed scanning mechanism make the P300TM system
essential for any production line application
FACTS2TM C-SAM©:
High-Resolution Acoustic Micro Imaging at Production Speeds
Fast Automated C-SAM® Tray Scanning System

The FACTS2TM Acoustic Microscope delivers state-of-the-art, automated AMI inspection for
quality and process control. Delivering high throughput with minimal operator interaction,
FACTS2 helps ensure defect-free production with potentially no reduction in throughput.
FACTS2 automatically inspects up to 10,000 integrated circuits per hour. Up to 35 JEDEC trays
of singulated ICs can be stacked as a batch, or trays can be inspected as part of an in-line
process. In addition, the FACTS2 can also handle multi-layer ceramic chip capacitors, flip chips
and other components.
AW200TM Series C-SAM®:
Fully Automated Wafer Bond Inspection (125mm to 200mm Diameter)
AW300TM Series C-SAM®:
Dual Loadports (optional), Fully Automated Wafer Bond Inspection (300mm Diameter)
The AW200TM Series is a high-capacity, high-throughput automated C-SAM® system designed
to deliver maximum sensitivity for the evaluation of bonded wafers in applications such as SOI,
MEMS and others. Since the materials used in these applications are very transparent to
ultrasound, Sonoscan uses proprietary high acoustic frequency lenses, which are designed in-
house, to obtain the most detailed images. The AW200 Series can detect voids smaller than 5
microns in diameter between two wafers and delamination with the separation between the
wafers as thin as 200 Angstroms.
The AW300TM Series is a high-capacity, high-throughput automated C-SAM® system designed
to deliver maximum sensitivity for the evaluation of bonded wafers in applications such as SOI,
MEMS and others. Since the materials used in these applications are very transparent to
ultrasound, Sonoscan uses proprietary high acoustic frequency lenses, which are designed in-
house, to obtain the most detailed images. The AW300 Series can detect voids smaller than 5
microns in diameter between two wafers and delamination with the separation between the
wafers as thin as 200 Angstroms.
Production Applications:
Laboratory Applications:
Gen6TM C-SAM®:
The New Generation of C-SAM Technology
Gen5TM C-SAM©:
A Revolution in Acoustic Micro Imaging
The Gen6TM C-Mode Scanning Acoustic Microscope is the newest generation in Acoustic
Microscopy Imaging (AMI) innovation. While taking the best from the Gen5™ (e.g. advanced
features, aesthetics, and ergonomics), the Gen6 improves upon the rest and takes acoustic
imaging to the next level. The Gen6 delivers the broadest range of capabilities available.
Whether your needs are for nondestructive failure analysis, process development, R&D, High-
Rel qualification for a military application, or low/medium-volume screening, the Gen6 is the one
C-SAM system that can meet all of your demands. Gen6 is perfect for a variety of applications,
such as; Microelectronics, MEMS, SSL LEDs, Power Modules, Solar, High-Tech materials,
etc.
The Gen5TM C-Mode Scanning Acoustic Microscope (C-SAM) takes acoustic scanning to a
higher level through advanced features and improved ergonomics. The Gen5 delivers a broad
range of capabilities. Whether your needs are for non-destructive failure analysis of a flip chip or
bonded wafer, process development, R&D, High-Rel qualification for a military application, or
medium-volume screening of a batch of smart cards, the Gen5 can meet all of your demands.
Tempronic ThermoChuck System
D9000TM C-SAM©:
The Gold Standard in Acoustic Microscopes
For failure analysis, process development, material characterization and other lab needs, the
D9000TM delivers advanced capabilities. Operating in both reflection and transmission modes,
the D9000 delivers maximum flexibility for detailed inspections. Using Sonoscan’s proprietary
transducers and employing the widest range of patented features and unique scanning modes,
the D9000 delivers highly accurate, high resolution and high quality acoustic images.
D9500TM C-SAM©:
The Contemporary Standard for Acoustic Microscopes

The D9500TM delivers maximum flexibility for detailed inspections. Whether your needs are for
failure analysis, process development, material characterization, low-volume production, or
other lab inspections, the D9500 delivers unmatched capabilities. Operating in both reflection
and transmission modes, the D9500 delivers a level of accuracy and robustness that sets the
contemporary standard for AMI.
D24TM C-SAM©:
Robustness and Accuracy for Large Samples
The D24TM is a semi-automated factory floor instrument capable of scanning boards and
samples up to 24”, or accommodating up to six JEDEC trays of components at one time. The
D24 delivers the robustness and accuracy of Sonoscan’s top lab instrument, but with very large
area coverage capabilities. Plus, the analysis can be programmed to be performed without
operator assistance, freeing your personnel for other duties while the inspection is in progress.
AWTM Series C-SAM®
Operator-Free Wafer Bond Inspection, Analysis and Sorting
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