Since its inception, Sonoscan has remained the most trusted authority on the application of Acoustic Microscopy, also known as Acoustic Micro Imaging (AMI) technology for nondestructive internal inspection and analysis. Sonoscan acoustic microscopes are recognized as the benchmark for accuracy, and through our SonoLab® division, you'll benefit from the unmatched expertise of our dedicated acoustic applications engineers.
Benefits of AMI (Acoustic Micro Imaging)
Locates hidden flaws before they lead to failures
Detects delamination as thin as 200 Angstroms
Isolates material property variations
Measures material density, porosity, inclusions, cracks and voids
Assesses thermal, impact and fatigue damage
FastLineTM P300TM C-SAM®:
Maximum Throughput, Minimal Footprint for the Factory Floor
The FastLineTM P300TM Acoustic Microscope is specifically designed for accelerated inspection throughput in manual screening of microelectronic devices on the manufacturing floor. With an integrated design to minimize footprint, the FastLine is the new platform for Acoustic Microscopes.
FastLineTM P300TM features a new electronics platform to meet current and next generation applications. New Movement MapTM technology delivers precise transducer positioning, while the Visual Poly-GateTM mode allows for simple and instant multiple depth imaging. These innovative features along with the higher speed scanning mechanism make the P300TM system essential for any production line application
High-Resolution Acoustic Micro Imaging at Production Speeds
Fast Automated C-SAM® Tray Scanning System
The FACTS2TM Acoustic Microscope delivers state-of-the-art, automated AMI inspection for quality and process control. Delivering high throughput with minimal operator interaction, FACTS2 helps ensure defect-free production with potentially no reduction in throughput. FACTS2 automatically inspects up to 10,000 integrated circuits per hour. Up to 35 JEDEC trays of singulated ICs can be stacked as a batch, or trays can be inspected as part of an in-line process. In addition, the FACTS2 can also handle multi-layer ceramic chip capacitors, flip chips and other components.
AW200TM Series C-SAM®:
Fully Automated Wafer Bond Inspection (125mm to 200mm Diameter)
AW300TM Series C-SAM®:
Dual Loadports (optional), Fully Automated Wafer Bond Inspection (300mm Diameter)
The AW200TM Series is a high-capacity, high-throughput automated C-SAM® system designed to deliver maximum sensitivity for the evaluation of bonded wafers in applications such as SOI, MEMS and others. Since the materials used in these applications are very transparent to ultrasound, Sonoscan uses proprietary high acoustic frequency lenses, which are designed in-house, to obtain the most detailed images. The AW200 Series can detect voids smaller than 5 microns in diameter between two wafers and delamination with the separation between the wafers as thin as 200 Angstroms.
The AW300TM Series is a high-capacity, high-throughput automated C-SAM® system designed to deliver maximum sensitivity for the evaluation of bonded wafers in applications such as SOI, MEMS and others. Since the materials used in these applications are very transparent to ultrasound, Sonoscan uses proprietary high acoustic frequency lenses, which are designed in-house, to obtain the most detailed images. The AW300 Series can detect voids smaller than 5 microns in diameter between two wafers and delamination with the separation between the wafers as thin as 200 Angstroms.
The New Generation of C-SAM Technology
A Revolution in Acoustic Micro Imaging
The Gen6TM C-Mode Scanning Acoustic Microscope is the newest generation in Acoustic Microscopy Imaging (AMI) innovation. While taking the best from the Gen5™ (e.g. advanced features, aesthetics, and ergonomics), the Gen6 improves upon the rest and takes acoustic imaging to the next level. The Gen6 delivers the broadest range of capabilities available. Whether your needs are for nondestructive failure analysis, process development, R&D, High-Rel qualification for a military application, or low/medium-volume screening, the Gen6 is the one C-SAM system that can meet all of your demands. Gen6 is perfect for a variety of applications, such as; Microelectronics, MEMS, SSL LEDs, Power Modules, Solar, High-Tech materials, etc.
The Gen5TM C-Mode Scanning Acoustic Microscope (C-SAM) takes acoustic scanning to a higher level through advanced features and improved ergonomics. The Gen5 delivers a broad range of capabilities. Whether your needs are for non-destructive failure analysis of a flip chip or bonded wafer, process development, R&D, High-Rel qualification for a military application, or medium-volume screening of a batch of smart cards, the Gen5 can meet all of your demands.
The Gold Standard in Acoustic Microscopes
For failure analysis, process development, material characterization and other lab needs, the D9000TM delivers advanced capabilities. Operating in both reflection and transmission modes, the D9000 delivers maximum flexibility for detailed inspections. Using Sonoscan’s proprietary transducers and employing the widest range of patented features and unique scanning modes, the D9000 delivers highly accurate, high resolution and high quality acoustic images.
The Contemporary Standard for Acoustic Microscopes
The D9500TM delivers maximum flexibility for detailed inspections. Whether your needs are for failure analysis, process development, material characterization, low-volume production, or other lab inspections, the D9500 delivers unmatched capabilities. Operating in both reflection and transmission modes, the D9500 delivers a level of accuracy and robustness that sets the contemporary standard for AMI.
Robustness and Accuracy for Large Samples
The D24TM is a semi-automated factory floor instrument capable of scanning boards and samples up to 24”, or accommodating up to six JEDEC trays of components at one time. The D24 delivers the robustness and accuracy of Sonoscan’s top lab instrument, but with very large area coverage capabilities. Plus, the analysis can be programmed to be performed without operator assistance, freeing your personnel for other duties while the inspection is in progress.
AWTM Series C-SAM®
Operator-Free Wafer Bond Inspection, Analysis and Sorting