CWI represents companies with leading solutions for Semiconductor & Contract Manufacturers, as well as Research & Development Laboratory. F&S Bondtec Wire Bonders are used in many leading Universities, Aerospace, and Medical device companies throughout the world. Whether you are searching for a semi-automated or fully-automatic bonder with applications in need of Ball, Wedge, Ribbon or Bump Bonding, our bonders can support standard fine wire sizes to heavy wire of varying materials. The leading companies we represent have the solution.
       
CWI Technical Sales  ·  Phone: 732-536-3964  ·  Fax: 732-536-0495  · 

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Features
Motorized X, Y, Z-Axis - Work Area: 100x115mm
Resolution: 0.25μm, Repeatability < 2μm
Theta-Axis: 1° Resolution with 1° Repeatability
Operating System: Windows 7 Interface
In-House Production Shortens Time-to-Market
High Mix Devices / Medium Volume Production
Fully Automatic Production with Perfect Quality
6 Wire Bonding Technologies on 1 Machine
Pass-Through Capability Standard
Unbeatable Flexibility / Intuitive Programmability
Unlimited Bond Programs & Layout Storage
Innovative & Adaptable Bond Settings
Most Powerful Pattern Recognitoin System
Desktop Micro Factory (1,000 to 10,000 Wirebonds Per Day)
Wire Bonding (Semi- to Fully-Automatic)
The 56XX & 58XX Series Bonders, are unique Benchtop Micro Production Systems, completely without competition on the world market. No other supplier even comes close to offering the features of this bonder: all wire bond processes on a single machine thanks to exchangeable bond heads; programmable for fully automatic single and multi-wire bonding operations with optional pattern recognition software.
 
EXCHANGEABLE BOND HEADS
 
5610 - Gold Ball Bonding
>>  Wire Size: 17.5 to 50μm; (Standard Capillary; 16 to 19mm)
>>  Ball Bumping, Security/Safety Bondings, Stitch-on-Ball
>>  Programmable Control of Bond Force for delicate component surfaces
>>  Digital Ultrasonic Generator provides adjustable bond frequencies
 
5630 - Thin Wire Wedge-Wedge Bonding
>>  Wire Size: 17.5 to 75μm (Gold & Aluminum Wire)
>>  Standard Feed 45° Wire Guide, convertible to 30° and 60°
>>  Deformation Limit Control (DLC) for real-time quality control
>>  Digital Ultrasonic Generator provides adjustable bond frequencies
 
5632 - Thin Wire Deep Access Wedge Bonding
>>  Wire Size: 17.5 to 75μm (Gold & Aluminum Wire or Ribbon)
>>  Standard 90° Wire Guide - Perfect for constricted bonding geometries
>>  Deformation Limit Control (DLC) - quality check & process monitoring
>>  Digital Ultrasonic Generator provides adjustable bond frequencies
 
5650 / 5650 HR - Heavy Wire or Ribbon Bonding
>>  Wire Size: 100 up to 500μm (Aluminum & Copper Wire)
>>  Ribbon Size: up to 2000μm width (Aluminum & Copper Ribbon)
>>  Wedge lengths of 50 to 70 mm - Stitch or Chain Bonding Capability
>>  Increase programmable power ramps & bond force up to 6,000 cN
>>  Deformation Limit Control (DLC) - quality check & process monitoring
 
EXCHANGEABLE BOND HEADS
 
5810 - Gold Ball Bonding
>>  Wire Size: 17.5 to 50μm; (Standard Capillary; 16 to 19mm)
>>  Ball Bumping, Security/Safety Bondings, Stitch-on-Ball
>>  Highly Sensitive, Contactless Electronic Touchdown Sensor Detection
>>  Programmable Control of Bond Force for delicate component surfaces
>>  Digital Ultrasonic Generator provides adjustable bond frequencies
 
5830 - Thin Wire Wedge-Wedge Bonding
>>  Wire Size: 17.5 to 75μm (Gold & Aluminum Wire)
>>  Standard Feed 45° Wire Guide, convertible to 30° and 60°
>>  Deformation Limit Control (DLC) for real-time quality control
>>  Digital Ultrasonic Generator provides adjustable bond frequencies
 
5832 - Thin Wire Deep Access Wedge Bonding
>>  Wire Size: 17.5 to 75μm (Gold & Aluminum Wire or Ribbon)
>>  Standard 90° Wire Guide - Perfect for constricted bonding geometries
>>  Deformation Limit Control (DLC) - quality check & process monitoring
>>  Digital Ultrasonic Generator provides adjustable bond frequencies
 
5850 / 5850 HR - Heavy Wire or Ribbon Bonding
>>  Wire Size: 100 up to 500μm (Aluminum & Copper Wire)
>>  Ribbon Size: up to 2000μm width (Aluminum & Copper Ribbon)
>>  Wedge lengths of 50 to 70 mm - Stitch or Chain Bonding Capability
>>  Increase programmable power ramps & bond force up to 6,000 cN
>>  Deformation Limit Control (DLC) - quality check & process monitoring
Features
Motorized X & Y-Axis - Work Area: 200x150mm
Motorized Z-Axis; 100mm Stroke
Step Resolution: 0.3μm, Repeatability < 2μm
Theta-Axis: 1° Resolution with 1° Repeatability
Operating System: Windows 7 Interface
In-House Production Shortens Time-to-Market
High Mix Devices / Medium Volume Production
Fully Automatic Production with Perfect Quality
6 Wire Bonding Technologies on 1 Machine
High Productivity Bonder at over 1 wire per sec.
Unbeatable Flexibility / Intuitive Programmability
Unlimited Bond Programs & Layout Storage
Innovative & Adaptable Bond Settings
Most Powerful Pattern Recognitoin System
The Production Machine (1,000 to 100,000 Wirebonds Per Day)