Backend Solutions
CWI represents companies with leading Backend solutions for Universities, R&D Labs, and small or large companies.  Whether you are doing
very basic assembly or leading edge applications, CWI has the solution to meet your requirements.
Die to Wafer Bonding:
Manual, Semi-Automated and
Fully-Automated Systems
Up to 12 inch wafers
Die Bonding and Flip Chip Bonding:
Manual, Semi-Automated and
Fully-Automated Systems
Down to 0.5um Alignment Accuracy
Die Sorting:
Manual, Semi-Automated and
Fully-Automated Systems
Defect, Bump, Probe Mark & TSV Inspection:
Inspection of Diced Wafers, 2D and 3D Inspection and Measurement of Bumps/Pillars, and other backend applications.
Wire Bonding:
Manual, Semi-Automated and
Fully-Automated Systems
Wedge and Ball Bonding
Bond Testing:
Die Shear, Wire Pull, Ball Shear, Tweezer Pull, Ribbon Peel, Stud Pull and much more...
Plasma Treatment System:
Fully-Automated, BCB & Bump Adhesion, Descum, Wafer & Via Cleaning for WLP, Encapsulation & Molding, Pre-Wire Bonding for LED.
Vacuum Plasma Treatment:
Bond-Prep, Cleaning, Descum, Die Attach, Encapsulation & Molding, Oxidation Reduction, Polyimide Etch, Pre-Flip Chip Underfill and Pre-Wire Bond for ASPA.
       
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495   

Multi-Functional Die Bonding Systems:
Manual, Semi-Automated and
Fully-Automated Systems
with a wide range of applications
Void-Free Soldering Systems:
Manual, Semi-Automated and
Fully-Automated Systems
Pressure Curing Oven:
Used to minimize or terminate voiding in applications such as FOW, DAP, DAF, TIM, RCBGA, CUF,  Fine Pitch CUF, 3DIC, 2.5D, DAP, DAF, NCF, and NCP
Wafer Level Pressure Curing Oven:
Used to minimize or terminate voiding in applications such as CUF,  Fine Pitch CUF, 3DIC, 2.5D, DAP, DAF, NCF, and NCP
Inspect.
Prep.
Solder.
Wire Bond.
Sort.
Die Bond.
Devoid.
Test.