Ball Bonding
Relying on over 20 years of wire bonding knowhow, TPT designs and manufactures a complete
range of manual and semi-automated wire bonders.  TPT Wire Bonders are used in many
leading Universities, Semiconductor manufacturers, Contract manufacturers, Aerospace and
Medical device companies throughout the world.
HB16
Semi-automated (Motorized Z- & Y-axis) Wire Bonder
Ball, Wedge & Ribbon bonding with one Bond Head
165mm wide, 19mm deep
Access & storage of all parameters.100 sets
HB10
Semi-automated (Motorized Z-axis) Wire Bonder
Ball, Wedge & Ribbon bonding with one Bond Head
165mm wide, 19mm deep
Access & storage of all parameters.100 sets
HB05
Manual Wire Bonder
Ball, Wedge & Ribbon bonding with one Bond Head
165mm wide, 19mm deep
Fast & East Control of all bond parameters
Related Products
XYZTEC Condor Sigma Multifunctional Bond Tester
Amicra AFC Fully-Automated Die Bonder
0.5um Accuracy
Amicra NovaPlus Fully-Automated Die Bonder
3um Accuracy
Tresky T-6000 Fully-Automated Die Bonder
7-10um Accuracy
Tresky T-4909
Manual Die Bonder
Tresky T-3002FC3
Manual High Accuracy Die Bonder
       
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495