· Handling Capability of Wafers and Masks at Various Size, Shape and Thickness.
· Innovative Image Acquisition Technology to Achieve High Detection Sensitivity.
· Independent Bright Field and Dark Field Channels working Simultaneously
· Achieve Reliable Detection of Surface and Morphology Defects.
· Optional, Patented Height Sensors (CTS™ and CCS™)
· Multiple Metrology Capabilities in a Single Platform.
· Automatic Defect Binning and Classification.
· Offline Simulator for High Productivity