Die / Flip Chip Bonding
Related Products
AMICRA Microtechnologies:
AFC - Fully Automatic High Accuracy Micro Assembly Cell
System Highlights:

·    High Precision Die / Flip Chip Bonding System
·    Accuracy +/- 0.5 µm @ 3Sigma
·   Highest Placement Accuracy’s in its Class
·    Dynamic Alignment
·    Cycle Time: 20 - 30 seconds per die
·    Eutectic Laser Soldering or Epoxy Bonding
·    Optional: Wafer Mapping & Post Bond Inspection

Markets Uses:

·    WLP R&D, Micro Optics, LED and MEMS Assembly
·    Semiconductor Advanced Packaging (3D, Stack Die, etc.)
·    Dedicated for Volume Optoelectronic Device Production
TRESKY:
T-3000/2-FC3 - Manual Die / Flip Chip Bonder with Beam Splitter Technology
AMICRA Microtechnologies:
NOVAPLUS - High Speed Dual Head Die Bonder
System Highlights:

·    High Precision Die -Flip Chip Bonding System
·    High Placement Accuracy +/- 3µm @ 3Sigma
·    Cycle Time: within 3 seconds per die
·    Dynamic Alignment
·    Modular Machine Concept for All Micro Assembly Applications
·    Eutectic Laser Soldering or Epoxy Bonding
·    Automatic Load of Wafer and Substrate
·    Magazine to Magazine or Inline System
·    Multi Flip Chip Bonding, Wafer Mapping, Post Bond Inspection

Markets Uses:

·    WLP R&D, MCM, RFID, LED, Optoelectronics, and MEMS Assembly
·    Semiconductor Advanced Packaging (TSV, eWLB, 3D, Stack Die, etc.)
·    Embedded Die and Automotive Sensors Applications

System Highlights:

·    Die Bonder & Component Placement Platform
·    High Placement Accuracy +/- 3µm
·    Beam Splitter Optics with Multi-Point Alignment
·   True Vertical Technology™
·    Programmable Z-Drive with Bonding Force Control
·    Pick-Up from Waffle-Pack / Gel-Pack or Wafer Optional
·    Process Inspection Camera

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, 3D Packaging, MEMS Assembly
·    MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID
·    Sensor Assembly, Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)
Beam Splitter Technology
TRESKY:
T-6000L - Fully Automated Die / Flip Chip Bonder
System Highlights:

·    All Purpose R&D, Pilot & Medium Size Production System
·    High Placement Accuracy +/- 8µm @ 3Sigma
·    Linear Motors / 0.1µm Resolution Glass Scales
·    Dispensing and Stamping Unit
·    Wafer Ring / Frame Handling
·    Tool Magazine (Automatic Exchange of Tools)
·    Standard Pick-Up from Wafer / Waffle-Pack  / Gel-Pack
·    Pattern Recognition System
·    Automatic 3-D Calibration
·    Process Inspection Up Looking Camera

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, 3D Packaging, MEMS Assembly
·    MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID
·    Sensor Assembly, Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)
Inspection System
TRESKY:
T-3000/2-FC3 - Manual Die / Flip Chip Bonder
TRESKY:
T-3002-M - Manual Die / Flip Chip Bonder
TRESKY:
T-4909 - Fully Manual Die Bonder System
System Highlights:

·    Die Bonder & Component Placement Platform
·    High Placement Accuracy +/- 10µm
·    True Vertical Technology™
·    Programmable Z-Drive with Bonding Force Control
·    Pick-Up from Waffle  / Gel-Pak or Wafer Optional
·    Process Inspection Camera Optional
·    Multi-Functional Software

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, 3D Packaging, RFID, MEMS Assembly
·    Thermocompression, MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic
·    Sensor Assembly, Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)

System Highlights:

·    Die Bonder & Component Placement Platform
·    High Placement Accuracy +/- 10µm
·    True Vertical Technology™
·    Manual Z-Axis & XY Placement Stage Support
·    Tresky Patented Fix Die Ejector Needle System
·    Pick-Up from Waffle  / Gel-Pak or Wafer Optional

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, RFID, MEMS Assembly
·    MOEMS, VCSEL, Ultrasonic, Thermosonic
·    Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)
System Highlights:

·    Budget Sensitive Manual Die Bonder
·    High Placement Accuracy +/- 10µm
·    True Vertical Technology™
·    Manual Z-Axis & XY Placement Stage Support
·   Force Controlled
·    Pick-Up from Waffle  / Gel-Pak

Markets Uses:

·    Die Attach, MOEMS, VCSEL, RFID, MEMS Assembly
·    Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)
XYZTEC Condor Sigma Multifunctional Bond Tester
MPI Fully-Automated Mapping Sorter
MPI Fully-Automated Chip Probe Station
TPT
Semi-Automated
Wire Bonder
The Flip Chip Package Industry, which is replacing the old wire bonding technologies, uses flip
chip bonders to attach wafer dies to the substrate directly. This highly advanced technology
requires exceptional accuracy and high-end vision inspection. With the market requiring more
high-density semiconductor packages, the demand for leading flip chip bonders is increasing.
Here are our solutions.
       
CWI Technical Sales  ·  Phone: 732-536-3964  ·  Fax: 732-536-0495  · 

TRESKY:
T-8000 - Fully Automated Die / Flip Chip Bonder
System Highlights:

·    All Purpose R&D, Pilot & Medium Size Production System
·    Fully Built on Granite
·    High Placement Accuracy +/- 5µm @ 3Sigma
·    Linear Motors / 0.1µm Resolution Glass Scales
·    Dispensing and Stamping Unit
·    Wafer Ring / Frame Handling
·    Tool Magazine (Automatic Exchange of Tools)
·    Standard Pick-Up from Wafer / Waffle-Pack  / Gel-Pack
·    Pattern Recognition System
·    Automatic 3-D Calibration
·    Process Inspection Up Looking Camera

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, 3D Packaging, MEMS Assembly
·    MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID
·    Sensor Assembly, Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)