Front End Solutions
Grind.
Coat.
Pattern.
      Wet            
   Process.
Sputter.
     ALD.
Anneal.
  Bond.
CWI represents companies with leading front end solutions for small to large companies. Whether you are searching for a advanced systems for
Grinding, Spin Coating, Mask Aligning, Sputter Deposition, Wet Process, Wafer Annealing, Bonding systems and CMP. The leading companies we
represent have the solutions.
OAI Mask Aligners:
Frontside and Backside
S-Cubed Prime, Chill, Coat, Bake:
Photoresist Processing Systems
PicoSun:
Atomic Layer Deposition
Allwin21 Corp.:
Sputter Deposition System
Allwin21 Corp.:
Rapid Thermal Process
OAI/AML Wafer Bonder:
In-situ Alignment Bonding
       
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495   

Revasum (formally Strasbaugh):
Advanced Wafer Grinding Systems
Wafer Process Systems:
Wet Benches and Plating Systems
Wafer Process Systems:
IPA Aerosol Dryers
(Liquid Diffusion Technology)
Revasum (formally Strasbaugh):
Chemical Mechanical Planarization