LED Test
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Wafer Prober.
Tape Prober.
Die Prober.
Semi-Automatic System
Semi-Automatic System
Fully-Automatic System
Model 3GP-W
Semi-Automatic Wafer Probing System
MPI is the world leader in both semiconductor wafer-level probing technology and LED testing
related equipment vendor. The company focuses in micro-probe technology for over a decade.
MPI aims to develop reliable, state-of-art probing technology in order to enhance the
competitiveness of his clients.
System Highlights:

    Various Wafer Types
    Multi-Die Probing Capability
    Self-Tuning Stable Probing Mark
    Flexible Alignment Methods
    Different Inking Conditions
    Products with Filing Management
    Easy-to-Use Operation
    Full Message Control
    Precise Driving System for Probing
    Fully Remote Interface Provided (TTL, RS232C, GPIB, Address Lines)
Model P7602
Fully-Automatic 4-6" Wafer Probing System
System Highlights:

    Wafer Loader and Mapping
    Dark Box (Optional)
    Fast Exchange Time for Wafer Handling
    Flexibility for Product Change
    Precise Wafer Alignment
    Easy-to-Use Operation & Probe Card Manipulator
    Different Inking Conditions
    Self-Tuning Stable Inspection Rule
    Products with Filing Management
    Network Linking for Map File
    Fully Remote Interface Provided (TTL, RS232C, GPIB, Address Lines)
Wafer Probers
Tape Probers
Model 3GP-VB
Semi-Automatic Tape Probing System
System Highlights:

    Dark Box
    Fastest Chip Scanning System
    Flexible Alignment Methods
    Easy-to-Use Operation
    Full Message Control
    Precise Driving System for Probing
    Products with Filing Management
    Fully Remote Interface Provided (TTL, RS232C, GPIB, Address Lines)
Model P8000/P80C4
Fully-Automatic Tape Probing System
System Highlights:

    Fastest Chip Scanning System
    Smart Chip Aligning Algorithm
    Flexible Lighting Option for Various Chip Types
    Easy-to-Use Touch Panel Operating Interface
    Applicable for 4-6 Wafer after Expansion
    Different Inking Conditions
    Option for Bad-Cut Inspection
    1-4 Channels - Multi-Chip Probing Capability)
    Zoom-Lens Option for Wide Chip Size Application
    Double or Quad Cassettes for Continuous Mass-Production
Die Prober
Model DP76XL
Fully-Automatic Die Probing System
System Highlights:

    Dark Box Design
    Significant Throughput Improvement
    More Accurate Data Correlation to Package Level Test
    New Application Development
    Product File Management
    Accurate Probing Capability
    Programmable Pick & Place Force
    Advanced Chip Defect Detection
    Sort Page Post Confirmation
    Fully Remote Interface Provided (TTL, RS232C, GPIB, Address Lines)
       
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495   

Model PT-370
Fully-Automatic LED Taping Systems
System Highlights:

    Compact, Rigid and Reliable LED-Auto System
    Intelligent Wafer Alignment & Chip Recognition
    Equipped with AOI Vision Inspection
    High Production: UPH 36~40K at ≤ 40ms Testing Time
    Compatible with Various Package Sizes: 0603, 0805, 020, 3014
     3020, 3528, 3806, 5050, 5630, 6030, etc.
    Products Management with Programmable Filing
    Fully Remote Interface Provided (TTL, RS232C, GPIB, Address Lines)
Tape & Reel
Test Handler
Model HL530B
Fully-Automatic LED Test Handler
System Highlights:

    Compact, Rigid and Reliable LED-Auto Sorting
    High Reliability in Test Stability
    Input Type: Parts Feeder with Hopper
    Test Station: One for Sphere
    Test Type: Bottom Probe / Top Measurement
    Mixed Bin Prevention
    Minimum Miss Handling
    High Production: UPH 24K at ≤ 90ms Testing Time
    Material Handling Capability: 3535 / 5050 (others available)
    Products Management with Programmable Filing
    Fully Remote Interface Provided (TTL, RS232C, GPIB, Address Lines)