Metrology and Inspection solutions including bare substrate inspection, with correlation to tools being
utilized by the substrate suppliers, EPI inspection (pits, scratches, carrots, etc.); inspection through all
of the steps of your process. Probe Mark Inspection, Bump Inspection, CD, Overlay, and Post-Dice
Inspection, all with the same system. An Advanced 3D Optical Profiling solution with precise step
height and roughness measurements.
Back End solutions for the most advanced applications. High Accuracy, High Speed Die Bonding to
basic flip chip bonding; Wire bonding with tightly controlled loop and length parameters, as well as,
basic systems for ball and wedge bonding with advanced capabilities only the automated systems
have. Then, test the bonds using the most advanced bond tester on the market. Advanced laser
micromachining of ceramics for packaging solutions.
Wafer and Package Level Test and Measurement solutions. Test devices electrically and optically or
environmentally at extreme temperatures.
Failure Analysis solutions for SEM or TEM preparation. Acoustic Microscopy solutions for
nondestructive failure analysis, process development, R&D, High-Rel qualification, or low/medium-
volume screening. Decapsulation systems with precise software control over the entire process and
Laser Cutting systems for a variety of materials.
Automation solutions for Wafer Sorting.
CWI provides the highest quality solutions at every step of the semiconductor device fabrication
process..
Cree XPG
LED equipment solutions for universities, R&D
labs, small to medium and large size
companies. CWI can provide solutions for the all
of the steps of your process:
Front End processing including Photoresist
Deposition, Mask Aligners, Rapid Thermal
Processing, Wet Process Stations and Wafer
Bonding.
Front End
Metrology / Inspection
Back End
Test & Measurement
Products
