cover glass inspection, through silicon inspection, and surface inspection for OQC; Probe Mark
Inspection, CD, Overlay, and post-dice inspection. An Advanced 3D Optical Profiling solution with
precise step height and roughness measurements and the ability to image and measure through cover
Back End solutions for the most advanced applications. High Accuracy, High Speed Die Bonding to
basic flip chip bonding; Wire bonding with tightly controlled loop and length parameters, as well as,
basic systems for ball and wedge bonding with advanced capabilities only the automated systems
have. Then, test the bonds using the most advanced bond tester on the market.
Wafer, Package of Strip Level Functional, Parametric and Reliability Test and Measurement solutions.
Test devices electrically or environmentally at extreme temperatures. High speed test handlers with or
without motion, as well as, on tape frame testing with full axis motion and testing under vacuum or
Failure Analysis solutions for SEM or TEM preparation. Acoustic Microscopy solutions for
nondestructive failure analysis, process development, R&D, High-Rel qualification, or low/medium-
volume screening. Decapsulation systems with precise software control over the entire process and
Laser Cutting systems for a variety of materials.
CWI provides the highest quality solutions at every step of the MEMS device fabrication process..
MEMS (accelerometers, gyroscopes, pressure
sensors, etc) equipment solutions for
universities, R&D labs, small to medium and
large size companies. CWI can provide solutions
for the all of the steps of your process:
Deposition, Frontside and Backside Mask
Aligners, Sputter Deposition, Wet Process
Stations and Wafer Bonding.