Metrology and Inspection solutions including Macro Inspection to discover gross lithography defects, cover glass inspection, through silicon inspection, and surface inspection for OQC; Probe Mark Inspection, CD, Overlay, and post-dice inspection. An Advanced 3D Optical Profiling solution with precise step height and roughness measurements and the ability to image and measure through cover glass.
Back End solutions for the most advanced applications. High Accuracy, High Speed Die Bonding to basic flip chip bonding; Wire bonding with tightly controlled loop and length parameters, as well as, basic systems for ball and wedge bonding with advanced capabilities only the automated systems have. Then, test the bonds using the most advanced bond tester on the market.
Wafer, Package of Strip Level Functional, Parametric and Reliability Test and Measurement solutions. Test devices electrically or environmentally at extreme temperatures. High speed test handlers with or without motion, as well as, on tape frame testing with full axis motion and testing under vacuum or pressure.
Failure Analysis solutions for SEM or TEM preparation. Acoustic Microscopy solutions for nondestructive failure analysis, process development, R&D, High-Rel qualification, or low/medium-volume screening. Decapsulation systems with precise software control over the entire process and Laser Cutting systems for a variety of materials.
Automation solutions for Wafer Sorting.
CWI provides the highest quality solutions at every step of the MEMS device fabrication process..
MEMS (accelerometers, gyroscopes, pressure sensors, etc) equipment solutions for universities, R&D labs, small to medium and large size companies. CWI can provide solutions for the all of the steps of your process:
Front End processing including Photoresist Deposition, Frontside and Backside Mask Aligners, Sputter Deposition, Wet Process Stations and Wafer Bonding.
Metrology / Inspection
Test & Measurement