· Capable of Inspecting Micro Elecro Mechanical Systems (MEMS)
· Supports the High Versatility of Device Geometries and Materials, High Aspect Ratio,
Complex Stacked Layers and Etching Processes
· Handling Capability of Wafers and Masks at Various Size, Shape and Thickness.
· Innovative Image Acquisition Technology to Achieve High Detection Sensitivity.
· Independent Bright Field and Dark Field Channels working Simultaneously
· Achieve Reliable Detection of Surface and Morphology Defects.
· Optional, Patented Height Sensors (CTS™ and CCS™)
· Automatic Defect Binning and Classification.
· Offline Simulator for High Productivity