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SELAs Microcleaving technology has proved itself the undisputed leader for dedicated, fast and artifact-free sample preparation. The MC600i is a fifth generation version of the award-winning Microcleaving series of sample preparation systems for SEM inspection and analysis.

The system achieves fully automatic, reliable and rapid cross-sectioning of wafer segments and dies. Dedicated software enables automatic mapping and navigating to targets, and features automatic off-loading for immediate inspection. These features, together with high throughput (9 min/sample) ensuring that sample preparation is never a bottleneck, high and consistent accuracy (less than 0.3 micron), and the excellent quality of cross-sections produced, significantly reduce the diagnostic cycle for failure analysis, characterization and process monitoring.
Sonoscan - C-SAMTM Acoustic Microscopy
ESI Laser Cutting System
MC600i - Microcleaver
Microcleaving System
The MC600i offers increased accuracy, enables cleaving of smaller wafer segments and dies, and allows cleaving as close as 0.5mm to a sample/wafer edge.
System Highlights:

    Fully Automatic and Programmable Process
    Fast Cleave Process within 3 Minutes
    Small Wafer Segment Capability
    Edge Cleaving - as near as 0.5mm to sample/wafer edge
    Cryo-Cooling Mechanism (LN2)
    High Magnification Optics (7500x)


    Turnaround Time Drastically Reduced
    Improves Yield Analysis
    Improves Characterization
    Improves and Enhances SEM and FIB Utilization
    High Productivity
    Low Cost of Ownership
Front End Metrology/Inspection Back End Test & Measurement
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495   

MPI TS150 Probe Station