Optoelectronics (lasers, VCSELS, photodiodes, lithium niobate modulators etc) equipment solutions for universities, R&D labs, small/medium and large size companies,. CWI can provide solutions for the all of the steps of your process:
Front End processing including Photoresist Deposition, Mask Aligners, Rapid Thermal Processors, Wet Process Stations and Wafer Bonding.
Metrology and Inspection solutions including inspection to discover gross lithography defects, surface inspection; Probe Mark Inspection, CD, Overlay, and post-dice inspection for dicing defects. An Advanced 3D Optical Profiling solution with precise step height and roughness measurements.
Back End solutions for the most advanced applications. High Accuracy (0.5 um), High Speed Die Bonding with laser eutectic bonding to basic flip chip bonding; Wire bonding with tightly controlled loop and length parameters, as well as, basic systems for ball and wedge bonding with advanced capabilities only the automated systems have. Then, test the bonds using the most advanced bond tester on the market.
Wafer level Functional and Reliability Test and Measurement solutions. Test devices optically or environmentally at extreme temperatures. Fully automated handlers to excite the devices and test their output.
Failure Analysis solutions for SEM or TEM preparation. Acoustic Microscopy solutions for nondestructive failure analysis, process development, R&D, High-Rel qualification, or low/medium-volume screening. Decapsulation systems with precise software control over the entire process and Laser Cutting systems for a variety of materials.
Automation solutions for Pick & Place and Wafer Sorting.
CWI provides the highest quality solutions at every step of the Optoelectronics device fabrication process..
Metrology / Inspection
Test & Measurement