Optoelectronics (lasers, VCSELS, photodiodes, lithium niobate modulators etc) equipment solutions for
universities, R&D labs, small/medium and large size companies,. CWI can provide solutions for the all
of the steps of your process:
Front End processing including Photoresist Deposition, Mask Aligners, Rapid Thermal Processors,
Wet Process Stations and Wafer Bonding.
inspection; Probe Mark Inspection, CD, Overlay, and post-dice inspection for dicing defects. An
Advanced 3D Optical Profiling solution with precise step height and roughness measurements.
Back End solutions for the most advanced applications. High Accuracy (0.5 um), High Speed Die
Bonding with laser eutectic bonding to basic flip chip bonding; Wire bonding with tightly controlled loop
and length parameters, as well as, basic systems for ball and wedge bonding with advanced
capabilities only the automated systems have. Then, test the bonds using the most advanced bond
tester on the market.
environmentally at extreme temperatures. Fully automated handlers to excite the devices and test their
Failure Analysis solutions for SEM or TEM preparation. Acoustic Microscopy solutions for
nondestructive failure analysis, process development, R&D, High-Rel qualification, or low/medium-
volume screening. Decapsulation systems with precise software control over the entire process and
Laser Cutting systems for a variety of materials.
Automation solutions for Pick & Place and Wafer Sorting.
CWI provides the highest quality solutions at every step of the Optoelectronics device fabrication