Pick & Place
Related Products
System Highlights:

·    Die Bonder & Component Placement Platform
·    High Placement Accuracy +/- 10µm
·    True Vertical Technology™
·    Manual Z-Axis & XY Placement Stage Support
·    Tresky Patented Fix Die Ejector Needle System
·    Pick-Up from Waffle  / Gel-Pak or Wafer Optional

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, RFID, MEMS Assembly
·    MOEMS, VCSEL, Ultrasonic, Thermosonic
·    Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)
TRESKY:
T-3002-M - Manual Die / Flip Chip Bonder
System Highlights:

·    Die Bonder & Component Placement Platform
·    High Placement Accuracy +/- 10µm
·    True Vertical Technology™
·    Programmable Z-Drive with Bonding Force Control
·    Pick-Up from Waffle  / Gel-Pak or Wafer Optional
·    Process Inspection Camera Optional
·    Multi-Functional Software

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, 3D Packaging, RFID, MEMS Assembly
·    Thermocompression, MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic
·    Sensor Assembly, Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)

TRESKY:
T-3000/2-FC3 - Manual Die / Flip Chip Bonder
Inspection System
System Highlights:

·    All Purpose R&D, Pilot & Medium Size Production System
·    High Placement Accuracy +/- 8µm @ 3Sigma
·    Linear Motors / 0.1µm Resolution Glass Scales
·    Dispensing and Stampling Unit
·    Wafer Ring / Frame Handling
·    Tool Magazine (Automatic Exchange of Tools)
·    Standard Pick-Up from Wafer / Waffle-Pack  / Gel-Pack
·    Pattern Recognition System
·    Automatic 3-D Calibration
·    Process Inspection Up Looking Camera

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, 3D Packaging, MEMS Assembly
·    MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID
·    Sensor Assembly, Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)
TRESKY:
T-6000L - Fully Automated Die / Flip Chip Bonder
TRESKY, SOLUTIONS FOR MICROELECTRONICS

For over 30 years, Tresky has been perfecting the art of creating handling and pick & place systems.
As a solutions provider, we support specific applications with our highly accurate and innovative systems. Starting from manual to automatic, from adhesives to tools, exactly as per our customer’s need. This is made possible by our extensive experience and modular setup which allows adapting various basic systems with countless options for new processes.
With almost one thousand devices installed across the world, often with special & customized equipment, we diligently work to fulfill complex process requirements.
Supported by a fast, flexible and professional team ready to be tested, we look forward to your challenge!
XYZTEC Condor Sigma Multifunctional Bond Tester
MPI Fully-Automated Mapping Sorter
MPI Fully-Automated Chip Probe Station
TPT
Semi-Automated
Wire Bonder
       
CWI Technical Sales  ·  Phone: 732-536-3964  ·  Fax: 732-536-0495  · 

System Highlights:

·    All Purpose R&D, Pilot & Medium Size Production System
·    Fully Built on Granite
·    High Placement Accuracy +/- 5µm @ 3Sigma
·    Linear Motors / 0.1µm Resolution Glass Scales
·    Dispensing and Stamping Unit
·    Wafer Ring / Frame Handling
·    Tool Magazine (Automatic Exchange of Tools)
·    Standard Pick-Up from Wafer / Waffle-Pack  / Gel-Pack
·    Pattern Recognition System
·    Automatic 3-D Calibration
·    Process Inspection Up Looking Camera

Markets Uses:

·    Die Attach, Die Sorting, Flip-Chip, 3D Packaging, MEMS Assembly
·    MOEMS, VCSEL, Photonics, Ultrasonic, Thermosonic, RFID
·    Sensor Assembly, Adhesive Bonding, Eutectic Bonding (AuAu, AuSn, etc.)
TRESKY:
T-8000 - Fully Automated Die / Flip Chip Bonder