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Related Products
Plasma Treatment
Nordson MARCH has a variety of plasma treatment solutions specifically designed for the unique needs of the advanced semiconductor packaging & assembly (ASPA), wafer level packaging (WLP), micro electro mechanical (MEMS), light emitting diode (LED)
and solar photovoltaic (PV) industries. Plasma applications include cleaning, wire bond strength improvement, enhance heat transfer in die attach, descum, metal oxide removal bump adhesion, stripping and etching, as well as eliminate silicone mold adhesion problems within LED packages.
Features and Benefits

·   Touch screen control and graphical user interface give
     real-time process information.

·   Flexible shelf architecture allows processing of a wide
     variety of piece parts, components or carriers.

·   13.56 MHz RF generator with automatic matching network
     delivers excellent process repeatability.

·   Convenient facility hook-ups for periodic calibration
     requirements used in validation processes.

·   Wide range of accommodating process gases including
     argon, oxygen, hydrogen, helium, and fluorinated gases.

·   Comes standard with two (2) electronic mass flow
     controllers for optimal gas regulation.
AP-300 & AP-600:
Bench-Top Plasma Treatment Systems
AP - Series
AP-600 Plasma System
AP-300 Plasma System
AP-1000:
Plasma Treatment System
AP-1000 Plasma System
Features and Benefits

·   Plasma chamber is constructed of 11-gauge stainless steel with all fixture components housed within an
     enclosure constructed of rugged power coated aluminum, for superior durability.


·   13.56 MHz RF generator with automatic impedance matching network delivers excellent process
     repeatability.


·   The chamber has multiple removable and adjustable shelves to accommodate a range of part carriers
     including magazines, trays, wafer and Auer boats.
AP-1500:
Plasma Treatment System
Features and Benefits

·   Extra-large “batch-type” plasma system used to clean and treat electronic components, circuit boards, and
     medical & life science devices for a variety of assembly and packaging applications.


·   All componetents of the plasma system are housed within an enclosure constructed of rugged power coated
     aluminum, for superior durability.


·   13.56 MHz RF generator with automatic impedance matching network delivers excellent process
     repeatability.


·   Up to 2,000 Watts of RF Power in a completely self-contained chassis.
AP-1500 Plasma System
Features and Benefits

·   Flexible configuration accommodates the full range of strip dimensions and magazine designs

·   Advanced robotic handling system minimizes strip handling, pushing, pulling and reduces operator
     intervention

·   New camera-based material tracking provides 100% plasma treatment validation

·   High-efficiency, application specific, plasma chamber design offers Direct or Ion Free plasma treatment
     modes

·   Significantly smaller system footprint and magazine reuse capability save space and help lower cost of
     ownership
FasTRAK:
Plasma Treatment System
FlexTRAK - Series
Plasma Processes Include: Pre-die attach for improved adhesion, Pre-wire bond for higher pull strength and CpKs,
Pre-mold to reduce delamination, Post-mold to remove flash, and Pre-underfill to reduce voiding.
FlexTRAK:
Plasma Treatment System
Features and Benefits

·   Easily integrates with a variety of process equipment, including wire bond, die attach, dispense, mold and
     marking equipment

·   Ultimate application flexibility for direct, downstream and ion-free (patent-pending) plasma which allows
     treatment without exposure to the direct plasma glow discharge

·   A compact, three-axis symmetrical chamber and proprietary process control for unmatched process
     uniformity

·   Industry-leading throughput capacity with short cycle times

·   A unique, slim structure that requires minimal floor space, all service components are easily accessible from
     the front
FasTRAK Plasma System
FlexTRAK Plasma System
FlexTRAK - 2MB:
Plasma Treatment System
The new in-line FlexTRAK-2MB plasma system’s boat handling system provides rapid material transfer for a
wide range of boat sizes (in one or two lanes). Processing can be done with most types of boats, trays and flat
carriers, yielding unmatched production flexibility. The patented FlexTRAK™ chamber design and control
architecture enable short plasma cycle times with very low overhead, ensuring that throughput is maximized
and cost of ownership is minimized.
FlexTRAK - BH:
Plasma Treatment System
FlexTRAK - CD:
Plasma Treatment System
FlexTRAK - SH:
Plasma Treatment System
FlexTRAK-WF:
Plasma Treatment System
Features and Benefits

·   Dual cassette load stations to minimize idle time

·   Multi-size capable aligner with minimal hardware change-over required

·   Robust robotic wafer engine

·   Integrated wafer recognition for high reliability wafer handling

·   Compact design minimizes floor space

·   Highly uniform treatment and fast throughput
Wafer Cleaning: Remove contamination prior to wafer bumping, Remove organic contamination, Remove Fluorine
and other halogen contamination, Remove metal and metal oxides, Improve spun-on film adhesion, Clean Aluminum
bond pads.
.
Wafer Etching: Descum wafer of residual photoresist / BCB, Pattern dielectric layers for redistribution, Strip / Etch
photoresist, Enhance adhesion of wafer-applied materials, Remove excess wafer-applied mold / epoxy, Enhance
adhesion of gold, solder bumps, Destress wafer to reduce breakage, Improve spun-on film adhesion, Clean
Aluminum bond pads
FlexTRAK-2MB Plasma System
FlexTRAK-BH Plasma System
FlexTRAK-CD Plasma System
FlexTRAK-SH Plasma System
FlexTRAK-WF Plasma System
XTRAK:
Plasma Treatment System
The XTRAK Plasma System can be configured in downstream, ion-free mode which removes ions, electrons and
photons, enabling the chemically active radicals and byproducts to perform the work. The patented XTRAK-IFP (Ion
Free Plasma ) System is ideal for cleaning pre-programmed memory devices when UV exposure may be an issue.
Multiple plasma modes allow unrestricted choice of process gas.
SMART TUNE™ MANAGEMENT SYSTEM

The XTRAK’s SMART Tune management system provides closed-loop plasma control that optimizes the RF
system and minimizes tuning time. The system automatically recycles to a plasma-ready state, compensating
for changes in vacuum pressure, temperature and varied lot sizes. Maximum power to the chamber is achieved
with a proprietary algorithm that constantly measures forward and reflective power inside the chamber.

The system operates in both automatic and manual modes, with a multi-processing feature that allows
implementation of single or multiple recipes in one operation. By integrating the XTRAK system with loaders,
the XTRAK operates in a standalone configuration. It can also run in an island formfactor to feed a designated
line of equipment, including component attach systems, wire bonders and dispense equipment.
VIA - Series
RIE - Series
HIGH-THROUGHPUT PROCESSING
HIGH-THROUGHPUT PROCESSING
The FlexTRAK-BH system’s integrated boat handling system provides rapid material transfer for a
wide range of boat sizes, up to 2 boats per plasma cycle. Processing can be done with most types
of boats, trays and flat carriers. The patented chamber design and control architecture enable short
plasma cycle times with very low overhead, ensuring that throughput is maximized and cost of
ownership is minimized.
HIGH-THROUGHPUT PROCESSING
The FlexTRAK-CD system’s integrated processing of lead frames and strips in a very compact chassis. The
handler provides rapid and reliable material transfer for a wide range of strip sizes, up to 10 strips per cycle.
Processing can be done from most types of strip magazines. The patented F3 chamber design and control
architecture enable short plasma cycle times with very low overhead, which maximizes throughput and
minimizes cost of ownership (COO).
HIGH-THROUGHPUT PROCESSING
The FlexTRAK-SH system’s integrated strip handling system provides rapid material transfer for a wide range
of strip sizes, up to 5 strips per cycle. Processing can be done from most types of magazines and carriers.
The patented chamber design and control architecture enable short plasma cycle times with very low
overhead, ensuring that throughput is maximized and cost of ownership is minimized.
XTRAK Plasma System
FlexVIA:
Plasma Treatment System
Features and Benefits

·   Efficient design, economical gas consumption, small footprint, and attractive system pricing all contribute to
     a low cost of ownership

·   Easy loading and versatile horizontal racks allow for maximum throughput

·   Single stage plasma process, and capacity for up to (18) 20" x 24" panels per cycle enable a rate of 80-120
     units per hour (UPH)

·   Patented, industry-proven plasma technologies provide superior surface treatment uniformity, prior to
     lamination, to improve adhesion and reliability of flexible materials
FlexVIA Plasma System
RollVIA:
Plasma Treatment System
Features and Benefits

·   High to low volume roll-to-roll vacuum plasma

·   Available in three (3) configurations to meet a wide variety of customer production requirements

·   Proven web handling technology

·   Patented plasma systems produce superior process uniformity

·   Flexible PCB applications include surface activation, cleaning and desmear

·   Small  footprint system with integrated pump package
RollVIA Plasma System
ProVIA & MaxVIA:
Plasma Treatment Systems
Features and Benefits

·   High throughput of HDI, flexible and rigid panels for maximum production flexibility

·   ProVIA accommodates multiple panel sizes within a small footprint

·   MaxVIA accommodates larger panel sizes within the same chassis as the ProVIA

·   2X units per hour (UPH) with the MaxVIA then the ProVIA, both systems processing
     is able to meet today’s demanding manufacturing schedules

·   Low CF4 gas consumption for desmear applications contributes to the lowest COO

·   Patented system technologies produce superior process uniformity at high demand
MaxVIA Plasma System
ProVIA Plasma System
PCB-400:
Plasma Treatment System
Features and Benefits

·   The PCB-400 Plasma Treatment System was created with advanced plasma technology, and has the ability
     to treat up to 4 panels per plasma cycle.

·   The system's compact size will allow customers with smaller facilities to acquire and utilize this modern,
     state-of-the-art plasma treatment system.
PCB-400 Plasma System
The PCB-400 Plasma Treatment System is designed for PCB production facilities, pilot lines, laboratories, universities, and R&D centers that require advanced plasma treatments, but do not require the panel capacity or high throughput of Nordson MARCH's advanced ProVIA™ or MaxVIA™ Plasma Systems.
PCB-Series:
Plasma Treatment System
The PCB-Series can be configured with a variety of process gases and a complete range of RF generators, pumps,
and blowers to meet the demands of rigorous 24-hour operation in any PCB manufacturing environment.
Ultimate Process Uniformity

Uniformity depends on precise and independent control of all process variables, including an even dispersion of
process gas and repeatable gas ionization. Nordson MARCH systems are designed to ensure systematic process
control - within a panel, from panel to panel and batch to batch.

Wafer Cleaning: Remove contamination prior to wafer bumping, Remove organic contamination, Remove Fluorine
and other halogen contamination, Remove metal and metal oxides, Improve spun-on film adhesion, Clean
Aluminum bond pads

Wafer Etching: Descum wafer of residual photoresist / BCB, Pattern dielectric layers for redistribution, Strip / Etch
photoresist, Enhance adhesion of wafer-applied materials, Remove excess wafer-applied mold / epoxy, Enhance
adhesion of gold, solder bumps, Destress wafer to reduce breakage
RIE-1701:
Reative Ion Etch Plasma System
The Nordson MARCH RIE-1701 Anisotropic Reactive Ion Etching (RIE) system delivers performance often
associated with high-investment etching tools. The system is excellent for metal etching, silicide etching and
etching of III-V compounds, anisotropic etching of nitrides, oxides and polyimides.
Key performance features of the RIE-1701 system include the large DC bias and the ability to
control process pressure independent of gas flow. The system allows users a wide variety of etch
profiles ranging from anisotropic requiring high aspect ratios to sloped walls.
FlexTRAK-WR:
Plasma System
FlexTRAK-WR is capable of direct, downstream or ion-free plasma processing for a wide range of semiconductor
applications. Wafer processing prior to typical back-end packaging steps - suitable for wafer-level packaging, flip
chip, or traditional packaging. FlexTRAK-WR three-axis symmetrical chamber and proprietary process control
provides unmatched process uniformity while minimizing cycle times.
RIE-1701 Reative Ion Etch System
FlexTRAK-WR Plasma System
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CWI Technical Sales  ·  Phone: 732-536-3964  ·  Fax: 732-536-0495  ·