Metrology and Inspection solutions including bare substrate inspection, with correlation to tools being
utilized by the substrate suppliers, EPI inspection (pits, scratches, carrots, etc.); inspection through all
of the steps of your process.  Probe Mark Inspection, Bump Inspection, CD, Overlay, and Post-Dice
Inspection, all with the same system.  An Advanced 3D Optical Profiling solution with precise step
height and roughness measurements.

Back End solutions for the most advanced applications. High Accuracy, High Speed Die Bonding to
basic flip chip bonding; Wire bonding with tightly controlled loop and length parameters, as well as,
basic systems for ball and wedge bonding with advanced capabilities only the automated systems
have. Then, test the bonds using the most advanced bond tester on the market.  

Wafer and Package Level Functional, Parametric and Reliability Test and Measurement solutions.
Test devices electrically up to or environmentally at extreme temperatures.

Failure Analysis solutions for SEM or TEM preparation.  Acoustic Microscopy solutions for
nondestructive failure analysis, process development, R&D, High-Rel qualification, or low/medium-
volume screening.  Decapsulation systems with precise software control over the entire process and
Laser Cutting systems for a variety of materials.

Automation solutions for Wafer Sorting.

CWI provides the highest quality solutions at every step of the semiconductor device fabrication
process..
Equipment solutions for fabrication and testing of
Power Device for universities, R&D labs, small to
medium and large size companies. CWI can
provide solutions for the all of the steps of your
process:

Front End processing including Photoresist
Deposition, Mask Aligners, Rapid Thermal
Processing, Wet Process Stations and Wafer
Bonding.
Products
       
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495