Pressure Curing Oven
Related Products
AblePrint Technology offers innovative solutions for assembly process issues and cost reductions.

The VFS (Void Free System) is a pressure curing oven that eliminates voids in FOW (Film Over Wire), DAP (Die Attach Pad), DAF (Die Attach Film), TIM (Thermal Interface Material), RCBGA, and CUF (Capillary Underfill).

The VTS (Void Terminator System) is an enhanced pressure curing oven that terminates voids in underfill for Fine Pitch CUF, 3DIC, 2.5D, DAP, DAF, NCF, NCP and  CUF (Capillary Underfill)

The WSO (Warpage Supression Oven) significantly reduces the warpage of a 3DIC wafer, SIP and C2W (Chip to Wafer).

The PRO (Pressure Reflow Oven) eliminates voids during the reflow process.
       
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495   

XYZTEC Sigma
Multifunctional
Bond Tester
Tresky T-6000L
Fully-Automated
Die Bonder
7-10um Accuracy
Applications
Sonoscan - C-SAMTM Acoustic Microscopy
Before
After
VFS
VTS
- Semiconductor
- PCB
- MEMS
- LED
- SMT