Pressure Curing Oven
AblePrint Technology offers innovative solutions for assembly process issues and cost reductions.
The VFS (Void Free System) is a pressure curing oven that eliminates voids in FOW (Film Over Wire), DAP (Die Attach Pad), DAF (Die Attach Film), TIM (Thermal Interface Material), RCBGA, and CUF (Capillary Underfill).
The VTS (Void Terminator System) is an enhanced pressure curing oven that terminates voids in underfill for Fine Pitch CUF, 3DIC, 2.5D, DAP, DAF, NCF, NCP and CUF (Capillary Underfill)
The WSO (Warpage Supression Oven) significantly reduces the warpage of a 3DIC wafer, SIP and C2W (Chip to Wafer).
The PRO (Pressure Reflow Oven) eliminates voids during the reflow process.