utilized by the substrate suppliers, EPI inspection (pits, scratches, carrots, etc.); inspection through all
of the steps of your process. Probe Mark Inspection, Bump Inspection, CD, Overlay, and Post-Dice
Inspection, all with the same system. An Advanced 3D Optical Profiling solution with precise step
height and roughness measurements.
Back End solutions for the most advanced applications. High Accuracy, High Speed Die Bonding to
basic flip chip bonding; Wire bonding with tightly controlled loop and length parameters, as well as,
basic systems for ball and wedge bonding with advanced capabilities only the automated systems
have. Then, test the bonds using the most advanced bond tester on the market.
Test devices electrically at DC or RF frequencies or environmentally at extreme temperatures.
Failure Analysis solutions for SEM or TEM preparation. Acoustic Microscopy solutions for
nondestructive failure analysis, process development, R&D, High-Rel qualification, or low/medium-
volume screening. Decapsulation systems with precise software control over the entire process and
Laser Cutting systems for a variety of materials.
CWI provides the highest quality solutions at every step of the semiconductor device fabrication
Equipment solutions for universities, R&D
labs, small/medium and large size companies
working on RF/Wireless devices,. CWI can
provide solutions for the all of the steps of
Deposition, Mask Aligners, Rapid Thermal
Processing, Wet Process Stations and Wafer