Semiconductor equipment solutions for universities, R&D labs, small/medium size companies, as well as, the fully-automated fabs. CWI can provide solutions for the all of the steps of your process:
Front End processing including Photoresist Deposition, Mask Aligners, Sputter Deposition, Rapid Thermal Processing, Wet Process Stations and Wafer Bonding.
Metrology and Inspection solutions including Macro Inspection to discover gross lithography defects, micro scratches and copper residue after CMP, and surface inspection for OQC; Probe Mark Inspection, 3D Bump Inspection, TSV metrology, CD, Overlay, and RDL Inspection. An Advanced 3D Optical Profiling solution with precise step height and roughness measurements.
Back End solutions for the most advanced 3D Integration with High Accuracy Die to Wafer Bonding to basic flip chip bonding; Wire bonding with tightly controlled loop and length parameters, as well as, basic systems for ball and wedge bonding with advanced capabilities only the automated systems have. Then, test the bonds using the most advanced bond tester on the market.
Wafer and Package Level Functional, Parametric and Reliability Test and Measurement solutions. Test devices electrically at DC or RF frequencies or environmentally at extreme temperatures.
Failure Analysis solutions for SEM or TEM preparation to reduce samples widths below 20 nanometers over a large area with high precision, artifact free quality and higher throughput. Acoustic Microscopy solutions for nondestructive failure analysis, process development, R&D, High-Rel qualification, or low/medium-volume screening. Decapsulation systems with precise software control over the entire process and Laser Cutting systems for a variety of materials.
Automation solutions for Wafer Sorting.
CWI provides the highest quality solutions at every step of the semiconductor device fabrication process..
Metrology / Inspection
Test & Measurement