Semiconductor equipment solutions for universities, R&D labs, small/medium size companies, as well
as, the fully-automated fabs. CWI can provide solutions for the all of the steps of your process:
Front End processing including Photoresist Deposition, Mask Aligners, Sputter Deposition, Rapid
Thermal Processing, Wet Process Stations and Wafer Bonding.
micro scratches and copper residue after CMP, and surface inspection for OQC; Probe Mark
Inspection, 3D Bump Inspection, TSV metrology, CD, Overlay, and RDL Inspection. An Advanced 3D
Optical Profiling solution with precise step height and roughness measurements.
Back End solutions for the most advanced 3D Integration with High Accuracy Die to Wafer Bonding to
basic flip chip bonding; Wire bonding with tightly controlled loop and length parameters, as well as,
basic systems for ball and wedge bonding with advanced capabilities only the automated systems
have. Then, test the bonds using the most advanced bond tester on the market.
devices electrically at DC or RF frequencies or environmentally at extreme temperatures.
Failure Analysis solutions for SEM or TEM preparation to reduce samples widths below 20 nanometers
over a large area with high precision, artifact free quality and higher throughput. Acoustic Microscopy
solutions for nondestructive failure analysis, process development, R&D, High-Rel qualification, or
low/medium-volume screening. Decapsulation systems with precise software control over the entire
process and Laser Cutting systems for a variety of materials.
CWI provides the highest quality solutions at every step of the semiconductor device fabrication