Void-Free Vacuum Soldering Systems
Related Products
PINK offers innovative soldering technologies for void-free connections of power semiconductors, hybrid- and multichip-assemblies as well as electronic packages. PINK provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.

The whole assortment - from Batch versions for laboratory applications and production of small series right up to full automated high performance inline systems - offers an identical processing technology and highest performance. A continuous recording of all process data ensures process reliability, quality and traceability.
VADU 100
Compact Soldering System under Vacuum
System Highlights:

    1 Vacuum Chamber
    2 Seperate Process Zones
    Process Area: 168 x 280 x 50mm
   Vacuum ≤ 2 mbar (standard)
   Soldering Temperatures up to 400 ºC
   5 kVa Power Input
    Integrated Pumping Unit
.
Options:

    Up to 6" Wafer
    Induction Heating
   Handling/Transfer Systems
   High Vacuum
       
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495   

MPI TS150 High Power Probe Station
XYZTEC Sigma
Multifunctional
Bond Tester
Tresky T-6000L
Fully-Automated
Die Bonder
7-10um Accuracy
PINK GmbH Thermosysteme
Soldering systems for vacuum-supported soldering
Applications
Semiconductor Industry
Power Electronics
Automotive Diodes and Sensors
Fiber Optic Devices
MMICs
High Power Lasers
Rail Drive Technology
Solar Cell Modules
Wind Power Station Technology
>The vacuum-supported soldering process by PINK provides void-free solder connections.<
High mass workpieces like this power module with a weight of 1,000g are reliably processed.
VADU 100 is designed for operation with paste, as well as preforms. Based on the compact design and the user friendliness, the system is very suitable for production of small series and in laboratories for research applications.
VADU 200 XL
Batch Soldering System under Vacuum
The VADU 200XL soldering unit is a batch system, designed for both paste and preform soldering. With its two hermetically separated process chambers the VADU 200XL system provides the precise control of all relevant process parameters e.g. the temperature gradients during heating and cooling. Due to this design a very fast heat transfer and an excellent temperature stability can be achieved.
System Highlights:

    2 Separated Vacuum Chamber
    Process Area: 410 x 280 x 100mm
   Vacuum ≤ 2 mbar (standard)
   Soldering Temperatures up to 400 ºC
   10 kVa Power Input
    Integrated Pumping Unit
.
Options:

    Up to 12" Wafer
    Induction Heating
   Handling/Transfer Systems
   High Vacuum
VADU 300 XL
Efficient Soldering System for Series Production
The further improved soldering system VADU 300XL is designed for high efficient series production with internal substrate handling and inline carrier transfer. According to customer requirements the loading or reloading operations can be realized manually or automatically.
System Highlights:

    Automated Inline System
    3 Vacuum Chamber
    Process Area: 410 x 280 x 100mm
   Vacuum ≤ 2 mbar (standard)
   Soldering Temperatures up to 400 ºC
   25 kVa Power Input
>VADU 300XL with robot automation for void-free high-quality soldering under vacuum. - either into existing or newly developed production lines.
Sonoscan - C-SAMTM Acoustic Microscopy
Options:

    Up to 12" Wafer
    Induction Heating
   Handling/Transfer Systems
   High Vacuum
RF/Microwave Packages
Power Modules
RF Amplifiers
Copper Pillar with Solder Cap Reflow
Medical Devices
Aerospace
High Reliability Devices
Hermetic Feed Throughs
Pressure Sensors
Void-Free Eutectic Die Attach
Flux-Free Solder Process Development
Hybrid Microelectronic Circuit Assembly