Wafer Level Chip Scale Package (WLCSP)
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Front End Metrology/Inspection Back End Test & Measurement
CWI Technical Sales  ·  Phone: 732-536-3964  ·  Fax: 732-536-0495  · 

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Wafer Test Solutions
IQtouchTM Micro
WLCSP Probe Card

Better Characterization, Improved Yields & Higher OEE for Wafer Level Testing

Johnstech's IQtouch™ Wafer Test Solutions
are based on a tradition of delivering innovative technologies, while providing industry-leading final test expertise.

The new IQtouch™ Micro Final Test Probe Arrays, for example, deliver unsurpassed low and stable contact resistance (CRES). This is accomplished through a balanced optimization among several critical and competing engineered parameters, including effective test signal transmission path, probe / wafer interface (“touch”) points and elastomeric web forces, and precision manufactured components for superior X/Y/Z co-planarity

·    Industry’s Lowest CRES
·    Stable, Accurate Test Signals
·    Predictable Signal Length/Path
·    Elastomeric Web Force Control
·    Confident Characterization
Product Engineers and Test Engineers can now leverage a final test probe card array that provides lowest and most stable CRES on the market, enabling accurate test results for the most critical test parameters on the most sensitive devices. Well-defined device characterization and corresponding specifications will help differentiate your company’s devices in a highly competitive and fast-moving market.
Production Floor Test Managers will achieve higher production floor OEE across all of the wafer probing test platforms with reliably robust technologies that quite simply deliver higher device first pass yields with more equipment uptime because probe cleaning requirements will be less frequent.

·    Increase Yields, Less Retest
·    Less Cleaning, Simplify Maintenance
·    Reliable Probe/Elastomer Dynamics
·    Superior Co-Planarity and Witness Marks
·    Increase Operational OEE
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