Wedge Bonding
TPT designs and manufactures a complete range of manual and semi-automated wire bonders.
TPT Wire Bonders are used in many leading Universities, Semiconductor manufacturers,
Contract manufacturers, Aerospace, and Medical device companies throughout the world.
HB05 / HB10 / HB16
Manual & Semi-Automated Wire Bonders
Ball, Wedge & Ribbon bonding with one Bond Head
165mm wide, 19mm deep
Fast & East Control of all bond parameters, 100 sets
Tresky T-4909
Manual Die Bonder
Tresky T-3002FC3
Manual High Accuracy Die Bonder
XYZTEC Condor Sigma Multifunctional Bond Tester
Amicra AFC Fully-Automated Die Bonder
0.5um Accuracy
Amicra NovaPlus Fully-Automated Die Bonder
3um Accuracy
Tresky T-6000 Fully-Automated Die Bonder
7-10um Accuracy
HB30
Heavy Wire Bonder - 100um to 500um wire
Up to 10 steps for individual loop profiles
165mm wide, 19mm deep
Fast & East Control of all bond parameters
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CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495