Wire Bonding (Manual to Semi-Automatic)
CWI represents companies with leading solutions for Semiconductor & Contract Manufacturers, as well as Research & Development Laboratory.

TPT Wire Bonders are used in many leading Universities, Aerospace, and Medical device companies throughout the world. Whether you are searching for a manual or semi-automated bonder with applications in need of Ball, Wedge, Ribbon or Bump Bonding, our bonders can support standard fine wire sizes to heavy wire of varying materials. The leading companies we represent have the solution.
       
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495   

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TPT Wire bonders have been designing and manufacturing wire bonders since 1996. They are a privately owned company providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry, from Universities and colleges to leading semiconductor, aerospace and medical device manufactures.

TPT was the first company to produce a wire bonder capable of both wedge and ball bonding, simply by changing the tool, a feature that is available across the range of fine wire bonders.
The TPT Series bench top wire bonders are easy to use and ideal for laboratories, pilot production runs and small scale production lines, configured with a single bondhead for both ball and wedge bonding. An intuitive user interface provides access to all bond parameters with 100 recipe storage capability. The HB16 Series also benefits from a motorized Y- and Z-Axis giving a greater control over wire loop manipulation, allowing users to create consistent and repeatable wire bonds with ease.
HB16 Semi-Automatic Wire Bonder (Motorized Z- & Y-Axis)
Features
Motorized Linear Z-Axis & Y-Axis (17mm Travel)
Loop Profile Software with up to 10 Steps
Intuitive User Interface & Touch Screen Control
Simple Conversion from Ball to Wedge Bonding
Deep and Wide Access Single Bondhead
Automatic Bond/Search Height Adjustment
Electronic Wire Clamp for Precise Tail Length
Real Unit Parameters of Force and Time
Motorised Wire Spooling for Consistent Looping
Gold, Aluminum, Copper & Silver Wire Metals
Wire Diameter Wedge 17-75µ (0.7 - 3mil)
Wire Diameter Ball/Bump 15-50µ (0.6 - 2mil)
Ribbon Size up to 25x250µ (1x10 mil)
165mm Bond Arm Length
90° Wire Feed Angle for Deep-Access
63kHz Transducer PLL Control (110kHz Option)
Ultrasonic Power 0-10 Watt, Bond Time 0-10sec.
Bond Force 15 - 150cNm (350cNm Option)
Technical Specification
HB10 Semi-Automatic Wire Bonder (Motorized Z-Axis)
Motorized Linear Z-Axis (17mm Travel)
Intuitive User Interface & Touch Screen Control
Simple Conversion from Ball to Wedge Bonding
Deep and Wide Access Single Bondhead
Automatic Bond/Search Height Adjustment
Electronic Wire Clamp for Precise Tail Length
Real Unit Parameters of Force and Time
Motorised Wire Spooling for Consistent Looping
The HB10 Series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configured with a single bondhead for both ball and wedge bonding. An intuitive user interface provides access to all bond parameters with 100 recipe storage capability. The HB10 Series also benefits from a motorized Z-Axis giving a greater control over wire loop manipulation, allowing users to create consistent and repeatable wire bonds with ease.
Features
Technical Specification
Gold, Aluminum, Copper & Silver Wire Metals
Wire Diameter Wedge 17-75µ (0.7 - 3mil)
Wire Diameter Ball/Bump 15-50µ (0.6 - 2mil)
Ribbon Size up to 25x250µ (1x10 mil)
165mm Bond Arm Length
90° Wire Feed Angle for Deep-Access
63kHz Transducer PLL Control (110kHz Option)
Ultrasonic Power 0-10 Watt, Bond Time 0-10sec.
Bond Force 15 - 150cNm (350cNm Option)
HB05 Fully Manual Wire Bonder (No Motorized Axis)
4.3" TFT Display with Intuitive User Interface
Simple Conversion from Ball to Wedge Bonding
Deep and Wide Access Single Bondhead
Electronic Ball Size Control
Electronic Wire Clamp for Precise Tail Length
Real Unit Parameters of Force and Time
Motorised Wire Spooling (Optional)
The HB05 Series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configured with a single bondhead for both ball and wedge bonding. An intuitive user interface provides access to all bond parameters with 20 recipe storage capability.
Features
Technical Specification
Gold, Aluminum, Copper & Silver Wire Metals
Wire Diameter Wedge 17-75µ (0.7 - 3mil)
Wire Diameter Ball/Bump 15-50µ (0.6 - 2mil)
Ribbon Size up to 25x250µ (1x10 mil)
165mm Bond Arm Length
90° Wire Feed Angle for Deep-Access
63kHz Transducer PLL Control (110kHz Option)
Ultrasonic Power 0-10 Watt, Bond Time 0-1sec.
Bond Force 15 - 130cNm
The TPT Series bench top heavy wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines. An intuitive user interface provides access to all bond parameters with 100 recipe storage capability. The HB30 Series also benefits from a motorized Y- and Z-Axis giving a greater control over wire loop manipulation, allowing users to create consistent and repeatable wire bonds with ease.
HB30 Semi-Automatic Heavy Wire Bonder (Motorized Z- & Y-Axis)
Features
Motorized Linear Z-Axis (20mm Travel)
Motorized Linear Y-Axis (17mm Travel)
Loop Profile Software with up to 10 Steps
Intuitive User Interface & Touch Screen Control
Deep and Wide Access Bondhead
Automatic Bond/Search Height Adjustment
High Precision Front Cutting Sequence
Real Unit Parameters of Force and Time
Vacuum Stage Fixation (Optional)
Technical Specification
Aluminum & Copper & Wire Metals
Wire Diameter 100 - 500µ (4 - 20mil)
Ribbon Size up to 300 x 2000µ (12x80mil)
6.5" Touch Screen UI Controller
Built-in Dual Fiber Optic Illuminator
60kHz Transducer PLL Control Generator
Ultrasonic Power 0-50 Watt, Bond Time 0-10sec.
Bond Force 15 - 1500cNm