200mm Probe Stations | CWI Technical Sales

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200mm Probe Stations

MANUAL SYSTEMS

TS200

Standard Configuration

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Unique puck controlled air bearing stage for
quick single-handed operation
Rigid platen accommodates up to 10 DC or 4 RF positioners
Highly repeatable platen lift design with three discrete positions

TS200-SE

DC/CV, RF and mmWave

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Design for Advanced EMI / RFI / Light-Tight Shielding
FemtoAmp low-leakage capabilities
Integrated active vibration isolation
Ready for temperature range -60 °C to 300 °C

TS200-THZ

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Seamless integration of any banded, differential or broadband frequency extenders and automated impedance tuners
Novel design of extenders/tuners integration for maximum of measurement dynamic

mmWave and sub-mmWave

TS200-HP

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Unique puck controlled air bearing stage for quick single-handed operation
Rigid platen accommodates up to 10 high voltage or 4 high current positioners

High Power up to 10kV, 600A

AUTOMATED SYSTEMS

TS2000

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Designed with easy single wafer front load
Large Probe Platen supporting up to 12x DC or 4x DC + 4x RF MicroPositioners or standard 4.5” probe card holder

Standard Configuration

TS2000-SE

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Device Modeling - DC-IV / DC-CV / Pulse-IV
RF and mmW - RF from 26 GHz to 110 GHz
FA - Probe card / Internode Probing
WLR - Hot/Cold/Long-term test

DC/CV, RF and mmWave

TS2000-IFE

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MPI IceFreeEnvironment™ for using MicroPositioners and probe cards simultaneously, even at negative temp
Programmable microscope movements for more automation and ease of use
The shortest cable interface to IC tester
Minimize the platen-to-chuck distance for mmW & probing with active probes
Supports film-frame probing

Flexible and Expandable

DC/CV, RF and mmWave

TS2000-HP

High Power up to 10kV/600A

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On wafer high power device measurement up to 10kV/600A
Gold plated chuck surface for minimum contact resistance and vacuum holes for thin wafer handling down to 50 μm
Taiko wafer chuck option
Dedicated high voltage and high current probes
Anti-arcing solutions

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