2.5D and 3D Underfill Void Removal

NCP/CUF/DAF/FOW Curing

Die Attach Curing

Controlled, Repeatable Process

Single Wafer

High Throughput

Cryogenic probe cards have all the benefits of Celadon’s Crash Resistant™ probe technology but with the ability to probe as cold as humanly possible. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovate custom PCB based designs to allow for flexibility when testing at these very cold temperatures.