CAMTEK
Whole & Diced Substrate Inspection
Unique solutions for:
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CMOS Image Sensor -Advanced solutions for the smallest pixels
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MEMS - Meeting your special application requirements
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LED - Yield improvement solutions
Advanced solutions for Fan-out applications:
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Down to 2µm RDL inspection
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Panel handling
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Warped wafer handling
Bump & Pillar Inspection
Eagle-T AP
Designed for the Advanced Packaging market, providing both 2D and 3D inspection and metrology on the same platform while keeping extremely high performance and throughput levels
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Next generation bumps down to 2µm
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Ultra high number of bumps measurement per wafer (50 million)
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Bump CD and surface detection
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RDL CD and height measurement
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TSV post-via-fill protrusions (nails)
Wire Bond, Hybrid and Microelectronics
MVP 900
Semiconductor, Wire Bond, Hybrid and Microelectronics Inspection
Key Features:
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Provides 3D, Telecentric and Microscopic Objective options for applications such as: Surface Inspection, Die Inspection, Wire Bond, Epoxy, +
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Handling Options:
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JEDEC Trays, Film Frame, Waffle Trays, Hybrid Modules, RF Modules, In-Line, Manual Load
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Data Integration Options:
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SECS-GEM, E142 Mapping, ELSR, AutoData
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MVP 900 DWMS
Die and Wire Bond Inspection System for Lead Frames
Key Features:
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3 Stage Conveyer System
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Dual Sided Load/Unload
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Strips Lead-Frames, Auer Boats, J-Boats, Trays
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Die Placement Metrology
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Die Surface, Edge Crack Detection
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Epoxy Spread and Flow Measurement
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Au, Al, Ag and Cu Wire to 1um Resolution
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Wedge, Ball and Stitch Wire Bonds
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Crescent and Tape Bonds
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SMT Components
MVP 2030 DWMS
High Throughput Inspection for Lead Frame, Die, Epoxy and Wire Inspection
Key Features:
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Inspection range from 1.7um to 5.6um
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Integrated Magazine Loaders/Unloaders
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UPH capability in excess of 150,000
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Die Placement Metrology
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Epoxy Spread and Bridging
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Die Surface, Edge Crack Detection
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Au, Al, Ag, and Cu Wires to 1um Resolution
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Leadframe Integrity
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SMT Components
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Certified for SEMI S2, S8 and IEC 61010-1
MVP Aurora
Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices
Key Features:
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Inspection range from 1.7um to 5.6um
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Integrated Magazine Loaders/Unloaders
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UPH capability in excess of 150,000
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Die Placement Metrology
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Epoxy Spread and Bridging
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Die Surface, Edge Crack Detection
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Au, Al, Ag, and Cu Wires to 1um Resolution
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Leadframe Integrity
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SMT Components
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Certified for SEMI S2, S8 and IEC 61010-1
MVP Aura
Single Sided Automated Inspection and Metrology for Packaged IC, BGA and Leaded Devices
Key Features:
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Single Sided Packaging Inspection with Defect Sorting
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Provides Part Markings, Coplanarity, Lead and Package Metrology
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Smallest Footprint providing this capability
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No limit on Package sizes
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Dual Technology Inspection - 2D and 3D
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SECS-GEM, E142 Mapping, ELSR
MVP Versa (3D Lighting)
MVP Versa Duo (Laser Profiler)
Versa Pro (Quad Moire')
Cross-Platform, High Performance 3D AOI for SMT and SPI
Key Features:
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Paste Inspection, Pre-Reflow, Post Reflow, Post Wave and Selective Solder
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12 MP Color Camera with 3D Lighting w/ Standard 5-10um pixel resolution
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Projector or Laser Based 3D capability with 1um Repeatability
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Standard Software Platform for all Places in the Line
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Linear axis and 0.5 um linear encoders
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Fast Programming Generation using ePro and Validate
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Import capabilities include Gerber, ODB++ and a variety of other formats
