S-CUBED
Scene 8
Lift Off Resist (LOR) Processing Overview
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The S-Cubed Scene 8 is a Lift Off Resist (LOR) processor designed to perform both LOR and Photoresist Patterning processes automatically and sequentially
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Two methods of lift off processing available depending on customer requirements:
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“Soak” the wafers to be “lifted off” in hot (approximately 70C) NMP. The treated wafers are then placed on a “pin” type chuck and “blasted” with high pressure NMP followed by an IPA rinse followed by DIW spin rinse and dry
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Simply blast the wafer surface with high pressure acetone and use a recycling system to recover the spent acetone with the final acetone rinse being the means by which the recycling material is refreshed
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Leonardo LO Series
Dry Metal Lift Off
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New method to lift off metal with adhesive tape from wafer
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Leonardo 200 Features:
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Wafer size: 150 - 200 mm
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Allows customer to choose solvent free process
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Even using solvent there is no need to destroy metal layer to reach photoresist
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Easier and more environmental friendly method to recycle precious metal waster
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