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PRODUCTS
The MC600i system utilizes Micro Cleaving and Precise Cleaving technologies in two main processes - full process and fast process.
System Highlights
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Turn-around time drastically reduced
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Improves yield analysis and characterization
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improves and enhances SEM imaging
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High productivity
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Low cost of ownership
MC10
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Perfect Cleave Mechanism (PCM) is a simple manual cleaving tool for cross-section of crystalline materials such as Si, GaN, GaAs, InPh, SiC and others.
System Highlights
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Perfect quality of cross-section
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High throughput
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Improves and enhances SEM imaging
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Compact size
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Low cost of ownership
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